ترجمه آماده – لیتوگرافی

In order to produce an integrated circuit, thin films of various materials are used as barriers to the diffusion or implantation of impurity atoms or as insulators between conductive materials and the silicon substrate. Holes, or windows, are cut through this barrier material wherever impurity penetration or contact is desired. Masks contain the patterns of windows that are transferred to the surface of the silicon wafer using a process called photolithography, Photolithography makes use of a highly refined version of the photoengraving process. The patterns are first transferred from the mask to a light-sensitive material called photoresist. Chemical or plasma etching is then used to transfer the pattern from the photoresist to the barrier material on the surface of the wafer. Each mask step requires successful completion of numerous processing steps, and the complexity of an IC process is often measured by the number of photographic masks used during fabrication. This chapter will explore the lithographic process, including mask fabrication, photoresist processes, and etching.